By Charles Pfeil
This ebook is for PCB designers who're designing forums with a number of very huge Ball Grid Array (BGA) programs. It explores the influence of dense BGAs with excessive pin-count on PCB layout and gives options for the inherent layout demanding situations. even though you'll no longer but were faced with the problems of routing BGAs and the impression on fabrication expenses and sign integrity, this booklet will exhibit those strength pitfalls in addition to how you can mitigate those difficulties
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Extra resources for BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs
O If the bypass capacitors for the BGA are placed on the same layer as the BGA, then you may minimize the number of vias 40 Chapter Three – HDI Stackups used for GND underneath the BGA. This will open routing channels which may be critical for an extremely dense board o You may still want vias for some of the GND pins to improve the return paths Disadvantages o If the return paths are managed with a minimum number of GND vias, there really isn’t a downside to using this method. o It is often thought that using the outer layers for GND will limit the number of buildup (smaller features) layers for routing signals.
50 Chapter Three – HDI Stackups Stackup G Figure 3-18: Stackup G Stackup G Comments: • Total score =14 • The ground plane on the outer layers provides the high rating for power and signal integrity. • The extended buried via and the skip via reduces the lamination and plating steps which lowers cost; however it also reduces route density. 51 BGA Breakouts and Routing Any-Layer-Via Stackups The any-layer-via stackup is an HDI variation that although currently expensive will become affordable over time and in my opinion provide the kind of stackup and via models that will be required for successful routing of very large and very fine-pitch BGAs.
8mm instead of 1mm, it could have 3721 pins. 23 BGA Breakouts and Routing The Near Future In order to increase functionality and continue to miniaturize, more pins will be added into smaller packages. 8mm pitch and more than 2000 pins. This type of device presents more than a threshold; it is a tipping point because it will require the use of HDI. Managing signal integrity, maintaining fabrication yields and low cost will simply be impossible with the standard through-via laminate. Within 5 years, use of this kind of package will be common.
BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs by Charles Pfeil